With our solutions, we help you solve the most critical aspects of your product designs through simulation. If you work with antenna, RF, microwave, PCB, package, IC design or even an electromechanical device, we provide you with the industry gold standard simulators. These solutions help you solve any electromagnetic, temperature, SI, PI, parasitic, cabling and vibration challenges in your designs. We build on this with complete product simulation, allowing you to achieve first pass success designing an airplane, car, cellphone, laptop, wireless charger, or any other system.
Ansys HFSS is a 3D electromagnetic (EM) simulation software for designing and simulating high-frequency electronic products such as antennas, antenna arrays, RF or microwave components, high-speed interconnects, filters, connectors, IC packages and printed circuit boards. Engineers worldwide use Ansys HFSS software to design high-frequency, high-speed electronics found in communications systems, advanced driver assistance systems (ADAS), satellites, and internet-of-things (IoT) products.
- Component-to-System EM Workflow
- Coupled EM System Solver
- Encrypted 3D Design Share
- Automatic Adaptive Meshing
SIwave helps you model, simulate and validate high-speed channels and complete power delivery systems typical in modern high-performance electronics. It accurately extracts multi-gigabit SERDES and memory buses, providing product sign-off compliance for various designs. SIwave’s full wave extraction of complete power distribution networks (PDN) enables you to verify noise margins and ensure impedance profiles are met through automatic decoupling analysis in low-voltage designs.
- Full-Wave SI/PI Extraction
- Feature: Virtual
- Impedance / Crosstalk / EMI Scanning
- Electro-Thermal Design
AnsysIcepak provides powerful electronic cooling solutions that utilize the industry leading Ansys Fluent computational fluid dynamics (CFD) solver for thermal and fluid flow analyses of integrated circuits (ICs), packages, printed circuit boards (PCBs) and electronic assemblies. The AnsysIcepak CFD solver uses the Ansys Electronics Desktop (AEDT) graphical user interface (GUI).
- Unstructured, Body-fitted Meshing
- Comprehensive Thermal Reliability Solution
- High-fidelity CFD Solver
- Industry Leading MultiscaleMultiphysics
Ansys EMA3D Cable
Ansys EMA3D Cable specializes in analyzing lightning-induced electromagnetic (EM) effects on large platforms as well as cable EMI/EMC problems in aircraft and automobile platforms to support EMC certification. EMA3D Cable bolsters the design-to-validation workflow with system-design evaluation for cable harness models in the aerospace, automotive, military, oil and gas, consumer electronics and energy sectors.
- SpaceClaim’s Direct Modeler UI
- Cable Cross-Sections Electrostatic Simulation
- Streamlined Cable-Focused Workflow
- Hybrid Transmission Line Harness
With Maxwell, you can precisely characterize the nonlinear, transient motion of electromechanical components and their effects on the drive circuit and control system design. By leveraging Maxwell’s advanced electromagnetic field solvers and seamlessly linking them to the integrated circuit and systems simulation technology, you can understand the performance of electromechanical systems long before building a prototype in hardware.
- Advanced Magnetic Modeling
- Multiphysics Couplings
- Bi-Directional CAD Integration
- Electric Drive Modeling
Motor-CAD enables design engineers to evaluate motor topologies and concepts across the full operating range, to produce designs that are optimized for performance, efficiency and size. Motor-CAD software’s four integrated modules—EMag, Therm, Lab, Mech—enable multiphysics calculations to be performed quickly and iteratively, so users can get from concept to final design in less time.
- Intuitive, Template-Based Set Up
- Full Operating Range Design
- Built-in EM, Thermal and Mechanical Solvers
- Thermal Sizing of Machines
Ansys Q3D Extractor
Ansys Q3D Extractor calculates the parasitic parameter of frequency-dependent resistance, inductance, capacitance and conductance (RLCG) for electronic products. Q3D Extractor is ideal for designing advanced electronics packages and connectors used in high-speed electronic equipment. It is also used for high-power bus bars and power converter components used in electrical power distribution, power electronics and electric drive systems.
- Solid Modelling
- Various Extraction Types
- Power/Signal Integrity Analysis
- Automatic, Adaptive Mesh Refinement
Ansys Sherlock automated design analysis provides fast and accurate life predictions for electronic hardware at the component, board and system levels in early design stages. Sherlock bypasses the ‘test-fail-fix-repeat’ cycle by empowering designers to accurately model silicon–metal layers, semiconductor packaging, printed circuit boards (PCBs) and assemblies to predict failure risks due to thermal, mechanical and manufacturing stressors–all before prototype.
- Validated Time-To-Failure Predictions
- AnsysIcepak& Mechanical Integrated Workflow
- Rapid ECAD to FEA Translation
- Complete Product Lifetime Curve
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